Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...
A new copper coating that kills bacteria quicker and in greater amounts than current formulations could soon be available for hospitals and other high-traffic facilities. A new copper coating that ...
DUBLIN--(BUSINESS WIRE)--The "Silver and Copper Antimicrobial Coatings Market, Size, Share, Outlook and Growth Opportunities 2019-2025" report has been added to ResearchAndMarkets.com's offering. This ...
The thermal problem the researchers seek to mitigate. The two-stage, unusual technique they investigated and tested. The multifaceted implications and results of their approach. Keeping hot components ...
Solyco is developing a new low-temperature technology for the interconnection of solar cells. It consists of a round copper core with a diameter of 280 μm that is covered by a very thin layer of ...
A new copper coating that kills bacteria quicker and in greater amounts than current formulations could soon be available for hospitals and other high-traffic facilities. Although current formulations ...
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