Electromagnetic-thermal co-simulation methods integrate the numerical assessment of electromagnetic fields with thermal analysis to predict the coupled behaviour of systems in which heat generation ...
Design engineers can now use RFPro to perform electromagnetic simulation for circuits in Intel 18A semiconductor process technology RFPro provides electromagnetic analysis of passive devices and their ...
Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...
Partnership addresses the needs of hardware engineers facing reliable power distribution problems during printed circuit board (PCB) design and layout Electromagnetic (EM) simulation technology ...
Maxwell’s Equations can be expressed in multiple variants – there are integral and differential versions in both frequency and time domains, along with quasi-static and full-wave forms. Their elegance ...
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Taiwan Semiconductor, Microsoft and Ansys team up to boost simulation of silicon photonic
Taiwan Semiconductor Manufacturing (NYSE:TSM), Ansys (NASDAQ:ANSS) and Microsoft (NASDAQ:MSFT) have collaborated to speed-up simulation and analysis of silicon photonic components by over 10 times.
The result of exhaustive research involving non-conforming, mesh-coupling techniques and edge-based vector elements plus nodal-based scalar elements, Maxwell 3D v10 3D/2D electromagnetic simulation ...
Keysight Technologies Inc. has announced the latest release of Electromagnetic Professional (EMPro) software, its 3-D electromagnetic simulation software. EMPro 2015.01 offers a number of new ...
TROY, Mich., March 20, 2024 /PRNewswire/ -- Altair (Nasdaq: ALTR), a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing ...
Direct links to simulation models for 13 of Kyocera AVX’s embedded antennas are available in Ansys HFSS 3D electromagnetic simulation software. As part of Ansys 2023 R1, models include embedded FR4 ...
Strategically designing heterostructures incorporating highentropy metal particles and carbon fibers can enhance the defect ...
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