EDN

Interconnect underdogs steering chiplet design bandwagon

The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California ...
Semiconductor Engineering

An Explosion In Interconnect Complexity

Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also ...
Electronic Specifier

Smiths Interconnect to showcase test solutions at DesignCon 2026

DesignCon, the US' premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center ...
EDN

AI workloads demand smarter SoC interconnect design

Artificial intelligence (AI) is transforming the semiconductor industry from the inside out, redefining not only what chips can do but how they are created. This impacts designs from data centers to ...
PC Gamer

Intel claims its optical interconnect chiplet technology is 'like going from using horse-drawn carriages to using cars and trucks'

It can deliver 4Tbps of bandwidth from 100m away. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. At the Optical Fiber Communications Conference ...
Seeking Alpha

Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design

CAMPBELL, Calif., Sept. 10, 2024 (GLOBE NEWSWIRE) -- Arteris, Inc. (AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that VeriSilicon (688521.SH), ...
Semiconductor Engineering

2024 Set The Stage For NoC Interconnect Innovations In SoC Design

What a year it’s been for Arteris! Reflecting on 2024, the company achieved exciting milestones and breakthroughs that pushed the boundaries of system-on-chip (SoC) design. A game-changing new ...

Heilind Features Molex SideWize High-Voltage Connectors for Space-Constrained Interconnect Designs

Heilind expands its Molex portfolio by adding SideWize High-Voltage Connectors—providing customers with enhanced performance, ...
HotHardware

Apple M3 Ultra May Ditch UltraFusion Interconnect For A Monolithic Design

Apple has taken what appears to be a logical approach to its Apple silicon releases. First, it will disperse onto its hardware the more basic iterations, such as the M3 Pro, and M3 Max. Next, it will ...
Nature

Electromigration in Copper Interconnects and Power Grid Networks

Electromigration (EM) remains a critical reliability challenge in modern microelectronic systems, particularly as device miniaturisation and increased current densities intensify the phenomenon. In ...
Electronic Design

Interconnect Manages Power And Data Flow

As systems-on-a-chip (SoCs) bring more functionality onto the chip itself, data flow becomes a daunting issue. To confront this design problem, Sonics, Inc. has come out with the SonicsMX solution.
Electronic Design

Interconnect IP Steers SoC Integration Into The Fast Lane

A nonblocking interconnect architecture smoothes the bumpy ride taken by SoC integration and IP reuse while ushering in a new abstraction level. Intellectual property (ip), and its reuse, is expected ...