Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...
Medical packaging sits at the intersection of materials science, sterilization, human factors, and global regulatory ...
Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around ...
Dublin, April 08, 2025 (GLOBE NEWSWIRE) -- The "Cell Therapy Packaging Market Industry Trends and Global Forecasts to 2035, by Type of Therapy Packed, Package Engineering Design, Scale of Operation ...
This concentration is designed to equip practitioners with the tools necessary to meet tomorrow’s challenges concerning packaging and its sustainability in the associated supply chains. To this end, ...
“Rapid Fire with Medical Packaging Trailblazers” on June 15 during Virtual Engineering Days will cover several pressing issues in medical device packaging. Rod Patch, senior director, package ...
RIT’s packaging science program recently received an equipment donation for its Packaging Dynamics Laboratory that will increase its academic and professional training options in safe-guarding shipped ...
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