Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in ...
Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump ...
Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...
Semiconductor manufacturing: Next-generation polyamide sheet shortens processing time and cuts costs
This company has developed a negative photo-definable polyimide sheet for glass-core substrates in used to connect chips to ...
Impact of PCB plating Finish on Elastomer Socket Technology Ila Pal – Ironwood Electronics Introduction Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below ...
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