Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

PI Introduces Miniaturized Alignment Engine Platform for Scalable, Parallel E/O Wafer-Level Test Parallel piezo aligners with fly height sensors enable faster PIC wafer testing.

Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix Designed to enhance the safety of operators and equipment; complies with regulations SANTA ROSA, ...

Aehr Test Systems faced challenges due to EV industry slowdown, but the recent earnings beat analyst expectations and sets a positive tone approaching 2025. The company's technological advantage in ...

United Microelectronics Corp (NYSE:UMC) reported a fourth-quarter FY23 revenue decline of 19.0% year-on-year to $1.79 billion (NT$54.96 billion), beating the consensus of $1.70 billion. The revenue ...