Live Science

MIT's chip stacking breakthrough could cut energy use in power-hungry AI processes

Engineers from MIT say that stacking circuit components on top of each other could be the answer to creating more ...
IEEE

Structural and Device Considerations for Vertical Cross Point Memory with Single-stack Memory toward CXL Memory beyond 1x nm 3DXP

Abstract: In this paper, we propose the structure of the 3D vertical cross point memory (3DVXP) having byte-addressability and discuss the possible challenges and requirements from the structural ...
GitHub

full-stack-project

A **real-time Chat Room application** built using the **MERN Stack (MongoDB, Express.js, React.js, Node.js)** that enables seamless user communication with a responsive UI, scalable backend, and ...
TechRadar

New 'serial' tech will significantly reduce the cost of memory — HBM memory, that is, the sort of RAM only AI hyperscalers can use, but hey, at least they won't go after ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performance Organic substrates reduce packaging costs and relax routing constraints in HBM designs Serialization shifts ...
IEEE

QLC Programmable 3D Ferroelectric NAND Flash Memory by Memory Window Expansion using Cell Stack Engineering

Abstract: 3D ferroelectric NAND (Fe-NAND) Quad-level cell (QLC) operation has been demonstrated for the first time to our knowledge, using the 3D CTN NAND test vehicle for mass production. The 3D ...