Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
{{ .fieldName }} // Get field from current item +{{ ["field with spaces"] }} // Field names with spaces/special chars +Stop searching through documentation! This ...
Abstract: Among various sensor array configurations, the L-shaped nested array offers improved performance for 2-D direction-of-arrival (DOA) estimation through co-array processing. However, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback